Smooth and vertical-sidewall InP etching using Cl2/N2 inductively coupled plasma
Identifieur interne : 00A746 ( Main/Repository ); précédent : 00A745; suivant : 00A747Smooth and vertical-sidewall InP etching using Cl2/N2 inductively coupled plasma
Auteurs : RBID : Pascal:04-0157312Descripteurs français
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- concept : Nickel.
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Abstract
Inductively coupled plasma (ICP) operated in the reactive-ion etching mode is used for mesa etching of InP using Cl2/N2 chemistry with a Ni metal mask. Etch rates of approximately 140 nm/min with very smooth and vertical sidewalls are obtained at a dc bias of 120 V. The effects of temperature, gas flow, chamber pressure, ICP source power, and substrate bias power on etch rate are studied; sidewall profile and surface morphology will be discussed. © 2004 American Vacuum Society.
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/N<sub>2</sub>
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<author><name sortKey="Lin, Jie" uniqKey="Lin J">Jie Lin</name>
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<author><name sortKey="Choa, Fow Sen" uniqKey="Choa F">Fow-Sen Choa</name>
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<front><div type="abstract" xml:lang="en">Inductively coupled plasma (ICP) operated in the reactive-ion etching mode is used for mesa etching of InP using Cl<sub>2</sub>
/N<sub>2</sub>
chemistry with a Ni metal mask. Etch rates of approximately 140 nm/min with very smooth and vertical sidewalls are obtained at a dc bias of 120 V. The effects of temperature, gas flow, chamber pressure, ICP source power, and substrate bias power on etch rate are studied; sidewall profile and surface morphology will be discussed. © 2004 American Vacuum Society.</div>
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